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l i t e - o n e l e c t r o n i c s , i n c . p r o p e r t y o f l i t e - o n o n l y features * lead (pb) free product C rohs compliant. * high intensity. * popular t-1 3/4 diameter package. * selected minimun intensities. * general purpose leads. * reliable and rugged. package dimensions part no. lens source color LTL-4253-052 yellow diffused yellow notes: 1. all dimensions are in millimeters (inches). 2. tolerance is 0.25mm(.010") unless otherwise noted. 3. protruded resin under flange is 1.0mm(.04") max. 4. lead spacing is measured where the leads emerge from the package. 5. specifications are subject to change without notice. 6. the led lamps use ltl-4253 part no. : LTL-4253-052 page : 1 of 11 bns-od-c131/a4
l i t e - o n e l e c t r o n i c s , i n c . p r o p e r t y o f l i t e - o n o n l y absolute maximum ratings at t a =25 parameter maximum rating unit power dissipation 60 mw peak forward current (1/10 duty cycle, 0.1ms pulse width) 80 ma continuous forward current 20 ma derating linear from 50 0.25 ma/ reverse voltage 5 v operating temperature range -55 to + 100 storage temperature range -55 to + 100 lead soldering temperature [2 mm(.078") from body] 260 for 5 seconds max. part no. : LTL-4253-052 page : 2 of 11 bns-od-c131/a4
l i t e - o n e l e c t r o n i c s , i n c . p r o p e r t y o f l i t e - o n o n l y electrical / optical characteristics at t a =25 parameter symbol min. typ. max. unit test condition luminous intensity i v 5.6 19 mcd i f = 10ma note 1,4 viewing angle 2 1/2 36 deg note 2 (fig.6) peak emission wavelength p 585 nm measurement @peak (fig.1) dominant wavelength d 588 nm note 3 spectral line half-width ? 35 nm forward voltage v f 2.1 2.6 v i f = 20ma reverse current i r 100 a v r = 5v capacitance c 15 pf v f = 0 , f = 1mhz note: 1. luminous intensity is measured with a light sensor and filter combination that approximates the cie (commission international de l'eclairage) eye-response curve. 2. 1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intens ity. 3. the dominant wavelength, d is derived from the cie chromaticity diagram and represents the single wavelength which defines the color of the device. 4. the iv guarantee should be added 15%. part no. : LTL-4253-052 page : 3 of 11 bns-od-c131/a4
l i t e - o n e l e c t r o n i c s , i n c . p r o p e r t y o f l i t e - o n o n l y typical electrical / optical characteristics curves (25 ambient temperature unless otherwise noted) part no. : LTL-4253-052 page : 4 of 11 bns-od-c131/a4
l i t e - o n e l e c t r o n i c s , i n c . p r o p e r t y o f l i t e - o n o n l y features * compatible with radial lead automatic insertion equipment. * most radial lead plastic lead lamps available packaged in tape and folding * 2.54mm (0.1") straight lead spacing available. * folding packaging simplifies handling and testing. package dimensions specification item symbol minimum maximum mm inch mm inch tape feed hole diameter d 3.8 0.149 4.2 0.165 component lead pitch f 2.3 0.091 3.0 0.118 front to rear deflection h -- -- 2.0 0.078 feed hole to bottom of component h1 22.5 0.886 23.5 0.925 feed hole to overall component height h2 30.8 1.212 32.4 1.275 lead length after component height l w0 11.0 0.433 feed hole pitch p 12.4 0.488 13.0 0.511 lead location p1 4.4 0.173 5.8 0.228 center of component location p2 5.05 0.198 7.65 0.301 total tape thickness t -- -- 0.90 0.035 feed hole location w0 8.5 0.334 9.75 0.384 adhesive tape width w1 14.5 0.571 15.5 0.610 adhesive tape position w2 0 0 3.0 0.118 tape width w3 17.5 0.689 19.0 0.748 part no. : LTL-4253-052 page : 5 of 11 bns-od-c131/a4
l i t e - o n e l e c t r o n i c s , i n c . p r o p e r t y o f l i t e - o n o n l y packing spec 2 reel per inner carton total 2,000pcs per inner carton 6 inner cartons per outer carton total 12,000 pcs per outer carton part no. : LTL-4253-052 page : 6 of 11 bns-od-c131/a4
l i t e - o n e l e c t r o n i c s , i n c . p r o p e r t y o f l i t e - o n o n l y bin table specification luminous intensity unit : mcd @10ma bin code min. max. m5 5.6 8.7 m4 8.7 12.6 m3 12.6 19 m2 19 29 m1 29 60 note : tolerance of each bin limit is 15% part no. : LTL-4253-052 page : 7 of 11 bns-od-c131/a4
l i t e - o n e l e c t r o n i c s , i n c . p r o p e r t y o f l i t e - o n o n l y cautions 1. application the leds described here are intended to be used for ordinary electronic equipment (such as office equipment, communication equipment and household applications).consult liteons sales in advance for inf ormation on applications in which exceptional reliability is required, particularly when the f ailure or malfunction of the leds may directly jeopardize life or health (such as in aviation, transportati on, traffic control equipment, medical and life support systems and safety devices). 2. storage the storage ambient for the leds should not exceed 30c temperature or 70% relative humi dity. it is recommended that leds out of their original packaging are used within three m onths. for extended storage out of their original packaging, it is recommended that the leds be stored in a sealed container with appropriate desiccant or in desiccators with nitrogen ambi ent. 3. cleaning use alcohol-based cleaning solvents such as isopropyl alcohol to clean the leds if nec essary. 4. lead forming & assembly during lead forming, the leads should be bent at a point at least 3mm from the base of led le ns. do not use the base of the leadframe as a fulcrum during forming. lead forming must be done before soldering, at normal temperature. during assembly on pcb, use minimum clinch force possible to avoid excessive mechani cal stress. 5. soldering when soldering, for lamp without stopper type and must be leave a minimum of 3 mm clearance from the base of the lens to the soldering point. to avoided the epoxy climb up on lead frame and was impact to non-soldering problem, dipping the lens into the solder must be avoided. do not apply any external stress to the lead frame during soldering while the led is a t high temperature. recommended soldering conditions : soldering iron wave soldering temperature soldering time 300c max. 3 sec. max. (one time only) pre-heat pre-heat time solder wave soldering time 100c max. 60 sec. max. 260c max. 5 sec. max. note: excessive soldering temperature and/or time might result in deformati on of the led lens or catastrophic failure of the led. ir reflow is not suitable process for through hole ty pe led lamp product. part no. : LTL-4253-052 page : 8 of 11 bns-od-c131/a4
l i t e - o n e l e c t r o n i c s , i n c . p r o p e r t y o f l i t e - o n o n l y 6. drive method an led is a current-operated device. in order to ensure intensity uniformity on multipl e leds connected in parallel in an application, it is recommended that a current limiting re sistor be incorporated in the drive circuit, in series with each led as shown in circuit a below . circuit model a circuit model b led led (a) recommended circuit (b) the brightness of each led might appear different due to the differences in the i -v characteristics of those leds 7. esd (electrostatic discharge) static electricity or power surge will damage the led. suggestions to prevent esd damage: use a conductive wrist band or anti- electrostatic glove when handling these leds all devices, equipment, and machinery must be properly grounded work tables, storage racks, etc. should be properly grounded use ion blower to neutralize the static charge which might have built up on surface of t he leds plastic lens as a result of friction between leds during storage and handing esd-damaged leds will exhibit abnormal characteristics such as high rever se leakage current, low forward voltage, or no light up at low currents. to verify for esd damage, check for light up and vf of the suspect leds at low currents. the vf of good leds should be >2.0v@0.1ma for ingan product and >1.4v@0.1ma for alingap product. part no. : LTL-4253-052 page : 9 of 11 bns-od-c131/a4
l i t e - o n e l e c t r o n i c s , i n c . p r o p e r t y o f l i t e - o n o n l y suggested checking list : training and certification 1. everyone working in a static-safe area is esd-certified? 2. training records kept and re-certification dates monitored? static-safe workstation & work areas 1. static-safe workstation or work-areas have esd signs? 2. all surfaces and objects at all static-safe workstation and within 1 ft meas ure less than 100v? 3. all ionizer activated, positioned towards the units? 4. each work surface mats grounding is good? personnel grounding 1. every person (including visitors) handling esd sensitive (esds) items wea r wrist strap, heel strap or conductive shoes with conductive flooring? 2. if conductive footwear used, conductive flooring also present where operator stand or wal k? 3. garments, hairs or anything closer than 1 ft to esd items measure less than 100v*? 4. every wrist strap or heel strap/conductive shoes checked daily and result recor ded for all dls? 5. all wrist strap or heel strap checkers calibration up to date? note: *50v for blue led. device handling 1. every esds items identified by eia-471 labels on item or packaging? 2. all esds items completely inside properly closed static-shielding containe rs when not at static-safe workstation? 3. no static charge generators (e.g. plastics) inside shielding containers wit h esds items? 4. all flexible conductive and dissipative package materials inspected before r euse or recycle? others 1. audit result reported to entity esd control coordinator? 2. corrective action from previous audits completed? 3. are audit records complete and on file? part no. : LTL-4253-052 page : 10 of 11 bns-od-c131/a4
l i t e - o n e l e c t r o n i c s , i n c . p r o p e r t y o f l i t e - o n o n l y 8. reliability test classification test item test condition reference standard operation life ta= under room temperature as per data sheet maximum rating * test time= 1000hrs (-24hrs,+72hrs) * test current = 20ma max. mil-std-750d:1026 (1995) mil-std-883d:1005 (1991) jis c 7021:b-1 (1982) high temperature high humidity storage ta= 655c rh= 90 95% test time= 240hrs2hrs mil-std-202f: 103b(1980) jis c 7021 : b-11(1982) high temperature storage ta= 1055c * test time= 1000hrs (-24hrs,+72hrs) mil-std-883d:1008 (1991) jis c 7021:b-10 (1982) endurance test low temperature storage ta= -555c * test time=1000hrs (-24hrs,+72hrs) jis c 7021:b-12 (1982) temperature cycling 105c 25c -55c 25c 30mins 5mins 30mins 5mins 10 cycles mil-std-202f:107d (1980) mil-std-750d:1051(1995) mil-std-883d:1010 (1991) jis c 7021: a-4(1982) thermal shock 105 5c -55c 5c 10mins 10mins 10 cycles mil-std-202f:107d(1980) mil-std-750d:1051(1995) mil-std-883d:1011 (1991) solder resistance t.sol = 260 c max. dwell time= 5 secs max. 3 times dip mil-std-202f:210a(1980) mil-std-750d:2031(1995) jis c 7021: a-1(1982) environmental test solderability t. sol = 230 5c dwell time= 5 1secs mil-std-202f:208d(1980) mil-std-750d:2026(1995) mil-std-883d:2003(1991) jis c 7021: a-2(1982) 9. others the appearance and specifications of the product may be modified for improvement, without pr ior notice. part no. : LTL-4253-052 page : 11 of 11 bns-od-c131/a

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